WAFER MAP TRIAGE ●

Classifies the failure pattern on wafer maps and suggests where to start looking. Runs on the public WM-811K dataset (811k maps from a real fab). The true label is shown under each wafer so you can check the model's call against it.
auto-decide when ≥ 90% confident
below that, it goes to review
How it works
  1. The input is a wafer map: the pass/fail result for each die after test. Nothing else goes in.
  2. A CNN trained on 173,000 labeled maps classifies the pattern into one of 9 known signatures (edge ring, scratch, center cluster, etc.) and gives a confidence score.
  3. Each signature has a list of usual causes attached. That mapping is written from fab experience, not learned by the model. An edge ring points at chamber uniformity or edge processes; a scratch points at handling. The model only names the pattern.
  4. Calls above the confidence cutoff are used automatically. Anything below it is queued for engineer review. The cluster map tab groups wafers by similarity without using labels, so a new failure mode that fits none of the 9 classes would show up there as a separate group.
sampling…
    Each dot is one wafer, placed using the CNN's internal representation (PCA to 2D). Wafers with similar failure patterns sit near each other, without using any labels. If a new failure mode appeared that fits none of the 9 classes, it would form its own group here. Hover to inspect a point, click to open that wafer.